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Layer: 4 L
Material: FR 4
Finish Board Thickness:2.0 MM
Finish Copper Thickness: 1/1/1/1 OZ
Surface Finish: ENIG(2 U'')
Min.Trace Width:0.1 MM
Min.Trace Space:0.1 MM
The size of BGA: 0.3 MM
Special Requirements:Via in Pad/Plug Vias by Epoxy Resin/Impedence.
FR 4 Board
Shenzhen XINRUI Electronic Co.ltd
printed, circuit, board, assembly stencil aluminum
